Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates

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	Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates
	H. F. Zou ; Z. F. Zhang
刊名	Journal of Electronic Materials
	2008
卷号	37 期号:8 页码:1119-1129
关键词	Sn-Ag-Zn lead-free solder gravity interfaces intermetallic compounds lead-free solders cu substrate bump metallization tensile properties phase-equilibria eutectic alloy ni behavior bi microstructure
ISSN号	0361-5235
中文摘要	In this study, the effect of Zn (Zn = 1 wt.%, 3 wt.%, and 7 wt.%) additions to Sn-4Ag solder reacting with Ag substrates was investigated under solid-state and liquid-state conditions. The composition and microstructure of the intermetallic compounds (IMCs) significantly changed due to the introduction of different Zn contents. In the case of Sn-4Ag solder with 1 wt.% Zn, a continuous Ag-Sn IMC layer formed on the Ag substrates; discontinuous Ag-Zn layers and Sn-rich regions formed on the Ag substrates under liquid-state conditions when the Sn-4Ag solders contained 3 wt.% and 7 wt.% Zn. If 3 wt.% Zn was added to Sn-4Ag solder, the Ag-Sn IMC would be transformed into a Ag-Zn IMC with increasing aging time. Rough interfaces between the IMCs and the Ag substrates were observed in Sn-4Ag-7Zn/Ag joints after reflowing at 260 degrees C for 15 min; however, the interfaces between the IMCs and the Ag substrates became smooth for Sn-4Ag-1Zn/Ag and Sn-4Ag-3Zn/Ag joints. The nonparabolic growth mechanism of IMCs was probed in the Sn-4Ag-3Zn/Ag joints during liquid-state reaction, and can be attributed to the detachment of IMCs. On the other hand, the effect of gravity was also taken into account to explain the formation of IMCs at the three different interfaces (bottom, top, and vertical) during the reflow procedure.
原文出处	://WOS:000257392500014
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://210.72.142.130/handle/321006/33419]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	H. F. Zou,Z. F. Zhang. Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates[J]. Journal of Electronic Materials,2008,37(8):1119-1129.
APA	H. F. Zou,&Z. F. Zhang.(2008).Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates.Journal of Electronic Materials,37(8),1119-1129.
MLA	H. F. Zou,et al."Effect of Zn addition on interfacial reactions between Sn-4Ag solder and Ag substrates".Journal of Electronic Materials 37.8(2008):1119-1129.