Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles

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	Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles
	E. W. Qin ; L. Lu ; N. R. Tao ; J. Tan ; K. Lu
刊名	Acta Materialia
	2009
卷号	57 期号:20 页码:6215-6225
关键词	Fracture toughness Nanostructures Nanoscale twins Dynamic plastic deformation Recrystallization dynamic plastic-deformation microstructural evolution mechanical-properties nanostructured metal tensile deformation grain-growth copper behavior ductility nickel
ISSN号	1359-6454
中文摘要	Bulk nanocrystalline pure Cu samples with embedded nanoscale twin bundles were prepared by means of dynamic plastic deformation (DPD) at cryogenic temperature. By adjusting the DPD parameters, we increased the volume fraction of nanotwin bundles, resulting in an increase in both tensile strength and fracture toughness. The enhanced strength is attributed to the strengthening effect of the nanotwin bundles. The highly anisotropic nanotwin lamellar structures are found to be effective in energy absorption and arresting crack propagation during fracture. Coarse and deep dimples associated with obvious recrystallization underneath were detected in the fracture surfaces, owing to the presence of the nanotwin bundles. The enhancement of fracture toughness is closely correlated with the formation of these deep dimples. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
原文出处	://WOS:000272111800025
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://210.72.142.130/handle/321006/32242]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	E. W. Qin,L. Lu,N. R. Tao,et al. Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles[J]. Acta Materialia,2009,57(20):6215-6225.
APA	E. W. Qin,L. Lu,N. R. Tao,J. Tan,&K. Lu.(2009).Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles.Acta Materialia,57(20),6215-6225.
MLA	E. W. Qin,et al."Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles".Acta Materialia 57.20(2009):6215-6225.