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	On strain-localized damage in nanoscale Cu-Ta multilayers on a flexible substrate
	X. F. Zhu ; Y. P. Li ; G. P. Zhang ; S. J. Zhu
刊名	Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
	2010
卷号	527期号:13-14页码:3279-3283
关键词	Nanoscale Grain rotation Plastic deformation Metallic multilayer nanocrystalline metals copper-films thin-films diffusion deformation strength flow
ISSN号	0921-5093
中文摘要	Through the careful examination of the tensile-deformed Cu-Ta multilayers with individual layer thickness of 10 nm, we found that alignment of grain boundaries occurred in the localized deformation zone close to channel cracks on the top Cu layer. Quantitative measurement of the variation amplitude of grain boundary path and theoretical analysis indicated that nanometer-scale movement of grains appeared to accommodate the localized plastic deformation in the Cu-Ta multilayer. The possible mechanisms for the nanometer-scale movement of the grains in the nanoscale metallic multilayer were evaluated. (C) 2010 Elsevier B.V. All rights reserved.
原文出处	://WOS:000276874700032
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://210.72.142.130/handle/321006/31798]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	X. F. Zhu,Y. P. Li,G. P. Zhang,et al. On strain-localized damage in nanoscale Cu-Ta multilayers on a flexible substrate[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2010,527(13-14):3279-3283.
APA	X. F. Zhu,Y. P. Li,G. P. Zhang,&S. J. Zhu.(2010).On strain-localized damage in nanoscale Cu-Ta multilayers on a flexible substrate.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,527(13-14),3279-3283.
MLA	X. F. Zhu,et al."On strain-localized damage in nanoscale Cu-Ta multilayers on a flexible substrate".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 527.13-14(2010):3279-3283.

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