| Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains | |
| Yao, Gongcheng; Mei, Qingsong; Li, Juying; Li, Congling; Ma, Ye; Chen, Feng; Zhang, Guodong; Yang, Bing | |
| 刊名 | METALS
 |
| 2016 | |
| 卷号 | 6期号:5 |
| 关键词 | accumulative roll-bonding pure copper microhardness electrical conductivity |
| ISSN号 | 2075-4701 |
| DOI | 10.3390/met6050115 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE |
| 语种 | 英语 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4090980 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Yao, Gongcheng,Mei, Qingsong,Li, Juying,et al. Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains[J]. METALS,2016,6(5). |
| APA | Yao, Gongcheng.,Mei, Qingsong.,Li, Juying.,Li, Congling.,Ma, Ye.,...&Yang, Bing.(2016).Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains.METALS,6(5). |
| MLA | Yao, Gongcheng,et al."Hard Copper with Good Electrical Conductivity Fabricated by Accumulative Roll-Bonding to Ultrahigh Strains".METALS 6.5(2016). |
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