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	Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test
	Xu, Ling; Wang, Miaocao; Zhou, Yang; Qian, Zhengfang; Liu, Sheng
刊名	Proceedings - Electronic Components and Technology Conference
	2016
卷号	2016-August
ISSN号	0569-5503
DOI	10.1109/ECTC.2016.172
URL标识	查看原文
收录类别	EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/4090444
专题	武汉大学
推荐引用方式 GB/T 7714	Xu, Ling,Wang, Miaocao,Zhou, Yang,et al. Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test[J]. Proceedings - Electronic Components and Technology Conference,2016,2016-August.
APA	Xu, Ling,Wang, Miaocao,Zhou, Yang,Qian, Zhengfang,&Liu, Sheng.(2016).Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test.Proceedings - Electronic Components and Technology Conference,2016-August.
MLA	Xu, Ling,et al."Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test".Proceedings - Electronic Components and Technology Conference 2016-August(2016).

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