Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test | |
Xu, Ling; Wang, Miaocao; Zhou, Yang; Qian, Zhengfang; Liu, Sheng | |
刊名 | Proceedings - Electronic Components and Technology Conference
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2016 | |
卷号 | 2016-August |
ISSN号 | 0569-5503 |
DOI | 10.1109/ECTC.2016.172 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4090444 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Xu, Ling,Wang, Miaocao,Zhou, Yang,et al. Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test[J]. Proceedings - Electronic Components and Technology Conference,2016,2016-August. |
APA | Xu, Ling,Wang, Miaocao,Zhou, Yang,Qian, Zhengfang,&Liu, Sheng.(2016).Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test.Proceedings - Electronic Components and Technology Conference,2016-August. |
MLA | Xu, Ling,et al."Effect of Silicone Gel on the Reliability of Heavy Aluminum Wire Bond for Power Module during Thermal Cycling Test".Proceedings - Electronic Components and Technology Conference 2016-August(2016). |
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