Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure | |
Lei, Xiang; Zheng, Huai; Guo, Xing; Zhang, Zefeng; Wu, Jiading; Xu, Chunlin; Liu, Sheng | |
刊名 | IEEE TRANSACTIONS ON POWER ELECTRONICS |
2017 | |
卷号 | 32期号:7 |
关键词 | Boron nitride (BN)/silicone die-bonding interface embedding packaging structure light-emitting diodes (LEDs) thermal resistance |
ISSN号 | 0885-8993 |
DOI | 10.1109/TPEL.2016.2609891 |
URL标识 | 查看原文 |
收录类别 | SCIE ; EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/4090343 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Lei, Xiang,Zheng, Huai,Guo, Xing,et al. Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure[J]. IEEE TRANSACTIONS ON POWER ELECTRONICS,2017,32(7). |
APA | Lei, Xiang.,Zheng, Huai.,Guo, Xing.,Zhang, Zefeng.,Wu, Jiading.,...&Liu, Sheng.(2017).Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure.IEEE TRANSACTIONS ON POWER ELECTRONICS,32(7). |
MLA | Lei, Xiang,et al."Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure".IEEE TRANSACTIONS ON POWER ELECTRONICS 32.7(2017). |
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