| Thermal Performance and Reliability Management for Novel Power Electronic Packaging using Integrated Base Plate | |
| Xu, Ling; Zhou, Yang; Wang, Miaocao; Zhang, Zejeng; Zhang, Charles; Qian, Zhengfang; Liu, Sheng | |
| 2015 | |
| 关键词 | power electronics packaging integrated base plate thermal performance reliability finite element methods |
| 收录类别 | CPCI-S |
| 会议录 | 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY
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| 语种 | 英语 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/4073744 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Xu, Ling,Zhou, Yang,Wang, Miaocao,et al. Thermal Performance and Reliability Management for Novel Power Electronic Packaging using Integrated Base Plate[C]. 见:. |
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