A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications

	A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications
	Geng, F ; Ding, XY ; Xu, GW ; Luo, L
刊名	JOURNAL OF MICROMECHANICS AND MICROENGINEERING
	2009
卷号	19 期号:10 Article Number 页码:105011
公开日期	2012-05-12
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/108759]
专题	上海微系统与信息技术研究所_传感技术联合国家重点实验室_期刊论文
推荐引用方式 GB/T 7714	Geng, F,Ding, XY,Xu, GW,et al. A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2009,19(10 Article Number):105011.
APA	Geng, F,Ding, XY,Xu, GW,&Luo, L.(2009).A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,19(10 Article Number),105011.
MLA	Geng, F,et al."A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 19.10 Article Number(2009):105011.