A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications | |
Geng, F ; Ding, XY ; Xu, GW ; Luo, L | |
刊名 | JOURNAL OF MICROMECHANICS AND MICROENGINEERING
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2009 | |
卷号 | 19期号:10 Article Number页码:105011 |
公开日期 | 2012-05-12 |
内容类型 | 期刊论文 |
源URL | [http://ir.sim.ac.cn/handle/331004/108759] ![]() |
专题 | 上海微系统与信息技术研究所_传感技术联合国家重点实验室_期刊论文 |
推荐引用方式 GB/T 7714 | Geng, F,Ding, XY,Xu, GW,et al. A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2009,19(10 Article Number):105011. |
APA | Geng, F,Ding, XY,Xu, GW,&Luo, L.(2009).A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,19(10 Article Number),105011. |
MLA | Geng, F,et al."A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 19.10 Article Number(2009):105011. |
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