An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling | |
Xu, Ling; Wang, Miaocao; Zhou, Yang; Qian, Zhengfang; Liu, Sheng | |
刊名 | MICROELECTRONICS RELIABILITY
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2016 | |
卷号 | 56 |
关键词 | DBC substrate Optimal structural design Reliability Thermal cycling |
ISSN号 | 0026-2714 |
DOI | 10.1016/j.microrel.2015.11.013 |
URL标识 | 查看原文 |
收录类别 | SCIE |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3892824 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Xu, Ling,Wang, Miaocao,Zhou, Yang,et al. An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling[J]. MICROELECTRONICS RELIABILITY,2016,56. |
APA | Xu, Ling,Wang, Miaocao,Zhou, Yang,Qian, Zhengfang,&Liu, Sheng.(2016).An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling.MICROELECTRONICS RELIABILITY,56. |
MLA | Xu, Ling,et al."An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling".MICROELECTRONICS RELIABILITY 56(2016). |
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