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	An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling
	Xu, Ling; Wang, Miaocao; Zhou, Yang; Qian, Zhengfang; Liu, Sheng
刊名	MICROELECTRONICS RELIABILITY
	2016
卷号	56
关键词	DBC substrate Optimal structural design Reliability Thermal cycling
ISSN号	0026-2714
DOI	10.1016/j.microrel.2015.11.013
URL标识	查看原文
收录类别	SCIE
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3892824
专题	武汉大学
推荐引用方式 GB/T 7714	Xu, Ling,Wang, Miaocao,Zhou, Yang,et al. An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling[J]. MICROELECTRONICS RELIABILITY,2016,56.
APA	Xu, Ling,Wang, Miaocao,Zhou, Yang,Qian, Zhengfang,&Liu, Sheng.(2016).An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling.MICROELECTRONICS RELIABILITY,56.
MLA	Xu, Ling,et al."An optimal structural design to improve the reliability of Al2O3-DBC substrates under thermal cycling".MICROELECTRONICS RELIABILITY 56(2016).

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