| The temperature and size effect on the electrical resistivity of Cu/V multilayer films | |
| Wang, P. P.; Wang, X. J.; Du, J. L.; Ren, F.; Zhang, Y.; Zhang, X.; Fu, E. G. | |
| 刊名 | ACTA MATERIALIA
 |
| 2017 | |
| 卷号 | 126 |
| 关键词 | Electrical resistivity Multilayer thin films Interface Grain boundary Temperature coefficient of resistivity |
| ISSN号 | 1359-6454 |
| DOI | 10.1016/j.actamat.2016.12.018 |
| URL标识 | 查看原文 |
| 收录类别 | SCIE ; EI |
| 语种 | 英语 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3890208 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Wang, P. P.,Wang, X. J.,Du, J. L.,et al. The temperature and size effect on the electrical resistivity of Cu/V multilayer films[J]. ACTA MATERIALIA,2017,126. |
| APA | Wang, P. P..,Wang, X. J..,Du, J. L..,Ren, F..,Zhang, Y..,...&Fu, E. G..(2017).The temperature and size effect on the electrical resistivity of Cu/V multilayer films.ACTA MATERIALIA,126. |
| MLA | Wang, P. P.,et al."The temperature and size effect on the electrical resistivity of Cu/V multilayer films".ACTA MATERIALIA 126(2017). |
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