| Effect of silicone gel on the reliability of heavy aluminum wire bond for power module during thermal cycling test | |
| Xu, Ling; Wang, Miaocao; Zhou, Yang; Qian, Zhengfang; Liu, Sheng | |
| 2016 | |
| 关键词 | aluminum wire bond power module silicone gel thermal cycle reliability |
| DOI | 10.1109/ECTC.2016.172 |
| 收录类别 | CPCI-S ; EI |
| 会议录 | 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC)
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| 语种 | 英语 |
| URL标识 | 查看原文 |
| ISSN号 | 0569-5503 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3837755 |
| 专题 | 武汉大学 |
| 推荐引用方式 GB/T 7714 | Xu, Ling,Wang, Miaocao,Zhou, Yang,et al. Effect of silicone gel on the reliability of heavy aluminum wire bond for power module during thermal cycling test[C]. 见:. |
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