Solder joint geometry of tin-lead alloy and its application in electronic packaging | |
Wang, GZ ; Zhu, QN ; Cheng, ZN ; Wang, CQ ; Qian, YY | |
刊名 | TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA |
1999 | |
卷号 | 9期号:4页码:733-740 |
ISSN号 | 1003-6326 |
学科主题 | Metallurgy & Metallurgical Engineering |
收录类别 | SCI |
语种 | 英语 |
公开日期 | 2012-03-25 |
内容类型 | 期刊论文 |
源URL | [http://ir.sim.ac.cn/handle/331004/99081] |
专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文(1999年以前) |
推荐引用方式 GB/T 7714 | Wang, GZ,Zhu, QN,Cheng, ZN,et al. Solder joint geometry of tin-lead alloy and its application in electronic packaging[J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,1999,9(4):733-740. |
APA | Wang, GZ,Zhu, QN,Cheng, ZN,Wang, CQ,&Qian, YY.(1999).Solder joint geometry of tin-lead alloy and its application in electronic packaging.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,9(4),733-740. |
MLA | Wang, GZ,et al."Solder joint geometry of tin-lead alloy and its application in electronic packaging".TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA 9.4(1999):733-740. |
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