Solder joint geometry of tin-lead alloy and its application in electronic packaging
Wang, GZ ; Zhu, QN ; Cheng, ZN ; Wang, CQ ; Qian, YY
刊名TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
1999
卷号9期号:4页码:733-740
ISSN号1003-6326
学科主题Metallurgy & Metallurgical Engineering
收录类别SCI
语种英语
公开日期2012-03-25
内容类型期刊论文
源URL[http://ir.sim.ac.cn/handle/331004/99081]  
专题上海微系统与信息技术研究所_功能材料与器件_期刊论文(1999年以前)
推荐引用方式
GB/T 7714
Wang, GZ,Zhu, QN,Cheng, ZN,et al. Solder joint geometry of tin-lead alloy and its application in electronic packaging[J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,1999,9(4):733-740.
APA Wang, GZ,Zhu, QN,Cheng, ZN,Wang, CQ,&Qian, YY.(1999).Solder joint geometry of tin-lead alloy and its application in electronic packaging.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,9(4),733-740.
MLA Wang, GZ,et al."Solder joint geometry of tin-lead alloy and its application in electronic packaging".TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA 9.4(1999):733-740.
个性服务
查看访问统计
相关权益政策
暂无数据
收藏/分享
所有评论 (0)
暂无评论
 

除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。


©版权所有 ©2017 CSpace - Powered by CSpace