Thermal performance and reliability management for novel power electronic packaging using integrated base plate | |
Zhou, Yang; Wang, Miaocao; Zhang, Zefeng; Liu, Sheng; Zhang, Charles; Qian, Zhengfang; Xu, Ling | |
刊名 | 16th International Conference on Electronic Packaging Technology, ICEPT 2015
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2015 | |
DOI | 10.1109/ICEPT.2015.7236661 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3759444 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Zhou, Yang,Wang, Miaocao,Zhang, Zefeng,et al. Thermal performance and reliability management for novel power electronic packaging using integrated base plate[J]. 16th International Conference on Electronic Packaging Technology, ICEPT 2015,2015. |
APA | Zhou, Yang.,Wang, Miaocao.,Zhang, Zefeng.,Liu, Sheng.,Zhang, Charles.,...&Xu, Ling.(2015).Thermal performance and reliability management for novel power electronic packaging using integrated base plate.16th International Conference on Electronic Packaging Technology, ICEPT 2015. |
MLA | Zhou, Yang,et al."Thermal performance and reliability management for novel power electronic packaging using integrated base plate".16th International Conference on Electronic Packaging Technology, ICEPT 2015 (2015). |
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