QQ客服 官方微博 反馈留言

	Thermal performance and reliability management for novel power electronic packaging using integrated base plate
	Zhou, Yang; Wang, Miaocao; Zhang, Zefeng; Liu, Sheng; Zhang, Charles; Qian, Zhengfang; Xu, Ling
刊名	16th International Conference on Electronic Packaging Technology, ICEPT 2015
	2015
DOI	10.1109/ICEPT.2015.7236661
URL标识	查看原文
收录类别	EI
语种	英语
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3759444
专题	武汉大学
推荐引用方式 GB/T 7714	Zhou, Yang,Wang, Miaocao,Zhang, Zefeng,et al. Thermal performance and reliability management for novel power electronic packaging using integrated base plate[J]. 16th International Conference on Electronic Packaging Technology, ICEPT 2015,2015.
APA	Zhou, Yang.,Wang, Miaocao.,Zhang, Zefeng.,Liu, Sheng.,Zhang, Charles.,...&Xu, Ling.(2015).Thermal performance and reliability management for novel power electronic packaging using integrated base plate.16th International Conference on Electronic Packaging Technology, ICEPT 2015.
MLA	Zhou, Yang,et al."Thermal performance and reliability management for novel power electronic packaging using integrated base plate".16th International Conference on Electronic Packaging Technology, ICEPT 2015 (2015).

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。