Design of microchannel heat sink using topology optimization for high power modules cooling | |
Li, Hao; Xu, Ling; Ding, Xiaohong; Liu, Sheng | |
刊名 | 18th International Conference on Electronic Packaging Technology, ICEPT 2017 |
2017 | |
DOI | 10.1109/ICEPT.2017.8046632 |
URL标识 | 查看原文 |
收录类别 | EI |
语种 | 英语 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3737697 |
专题 | 武汉大学 |
推荐引用方式 GB/T 7714 | Li, Hao,Xu, Ling,Ding, Xiaohong,et al. Design of microchannel heat sink using topology optimization for high power modules cooling[J]. 18th International Conference on Electronic Packaging Technology, ICEPT 2017,2017. |
APA | Li, Hao,Xu, Ling,Ding, Xiaohong,&Liu, Sheng.(2017).Design of microchannel heat sink using topology optimization for high power modules cooling.18th International Conference on Electronic Packaging Technology, ICEPT 2017. |
MLA | Li, Hao,et al."Design of microchannel heat sink using topology optimization for high power modules cooling".18th International Conference on Electronic Packaging Technology, ICEPT 2017 (2017). |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论