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Microstructure and of mechanics microwave boriding
YE Weiping; HUANG Zilin; ZHANG Qiaoxin; ZHANG Qinyi
刊名Journal Wuhan University of Technology, Materials Science Edition
2008
卷号23期号:4页码:528-531
关键词microwave boriding boriding layer diffusion activation energy
ISSN号1000-2413
DOI10.1007/s11595-006-4528-6
URL标识查看原文
WOS记录号WOS:000259590800024;EI:20083811571502
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/3397243
专题武汉理工大学
作者单位1.[YE Weiping
2.HUANG Zilin
3.ZHANG Qinyi] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China.
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GB/T 7714
YE Weiping,HUANG Zilin,ZHANG Qiaoxin,et al. Microstructure and of mechanics microwave boriding[J]. Journal Wuhan University of Technology, Materials Science Edition,2008,23(4):528-531.
APA YE Weiping,HUANG Zilin,ZHANG Qiaoxin,&ZHANG Qinyi.(2008).Microstructure and of mechanics microwave boriding.Journal Wuhan University of Technology, Materials Science Edition,23(4),528-531.
MLA YE Weiping,et al."Microstructure and of mechanics microwave boriding".Journal Wuhan University of Technology, Materials Science Edition 23.4(2008):528-531.
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