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	Microstructure evolution and mechanical behavior of the Ni/Ni3Al interface under thermal-mechanical coupling
	Yu, Jingui; Zhang, Qiaoxin*; Yue, Zhufeng; Liu, Rong; Tang, Mingkai; Li, Xuewu
刊名	Materials Express
	2015
卷号	5期号:4页码:343-350
关键词	Ni/Ni3Al Interface Thermal-Mechanical Coupling Molecular Dynamics Microstructure Evolution
ISSN号	2158-5849
DOI	10.1166/mex.2015.1238
URL标识	查看原文
WOS记录号	WOS:000356206900009
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3385330
专题	武汉理工大学
作者单位	1.[Yu, Jingui 2.Liu, Rong 3.Tang, Mingkai 4.Zhang, Qiaoxin 5.Li, Xuewu] Wuhan Univ Technol, Sch Mech & Elect Engn, Wuhan 430070, Peoples R China.
推荐引用方式 GB/T 7714	Yu, Jingui,Zhang, Qiaoxin*,Yue, Zhufeng,et al. Microstructure evolution and mechanical behavior of the Ni/Ni3Al interface under thermal-mechanical coupling[J]. Materials Express,2015,5(4):343-350.
APA	Yu, Jingui,Zhang, Qiaoxin*,Yue, Zhufeng,Liu, Rong,Tang, Mingkai,&Li, Xuewu.(2015).Microstructure evolution and mechanical behavior of the Ni/Ni3Al interface under thermal-mechanical coupling.Materials Express,5(4),343-350.
MLA	Yu, Jingui,et al."Microstructure evolution and mechanical behavior of the Ni/Ni3Al interface under thermal-mechanical coupling".Materials Express 5.4(2015):343-350.

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