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Preparation and thermal stability of heat-resistant phenolic resin system constructed by multiple heat-resistant compositions containing boron and silicon
Wang, Fengyi*; Huang, Zhixiong; Zhang, Guangwu; Li, Yunxia
刊名High Performance Polymers
2017
卷号29期号:4页码:493-498
关键词Phenolic boric acid phenyltriethoxysilane thermal stability structure
ISSN号0954-0083
DOI10.1177/0954008316644971
URL标识查看原文
WOS记录号WOS:000400902800013;EI:20172003662921
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/3385173
专题武汉理工大学
作者单位1.[Wang, Fengyi
2.Li, Yunxia
3.Zhang, Guangwu
4.Huang, Zhixiong] Wuhan Univ Technol, Sch Mat Sci & Engn, Luoshi Rd 122, Wuhan 430070, Peoples R China.
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GB/T 7714
Wang, Fengyi*,Huang, Zhixiong,Zhang, Guangwu,et al. Preparation and thermal stability of heat-resistant phenolic resin system constructed by multiple heat-resistant compositions containing boron and silicon[J]. High Performance Polymers,2017,29(4):493-498.
APA Wang, Fengyi*,Huang, Zhixiong,Zhang, Guangwu,&Li, Yunxia.(2017).Preparation and thermal stability of heat-resistant phenolic resin system constructed by multiple heat-resistant compositions containing boron and silicon.High Performance Polymers,29(4),493-498.
MLA Wang, Fengyi*,et al."Preparation and thermal stability of heat-resistant phenolic resin system constructed by multiple heat-resistant compositions containing boron and silicon".High Performance Polymers 29.4(2017):493-498.
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