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	Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration
	Liao, Guanglan; Chen, Pengfei*; Du, Li; Su, Lei; Liu, Zhiping; Tang, Zirong; Shi, Tielin
刊名	Microelectronics Reliability
	2015
卷号	55期号:12页码:2826-2832
关键词	Three-dimensional integration Missing-bump defect X-ray Self-organizing map neural network
ISSN号	0026-2714
DOI	10.1016/j.microrel.2015.09.009
URL标识	查看原文
WOS记录号	WOS:000367773300028;EI:20153801295810
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3376585
专题	武汉理工大学
作者单位	1.[Liao, Guanglan 2.Chen, Pengfei 3.Tang, Zirong 4.Du, Li 5.Su, Lei 6.Shi, Tielin] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Hubei, Peoples R China.
推荐引用方式 GB/T 7714	Liao, Guanglan,Chen, Pengfei*,Du, Li,et al. Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration[J]. Microelectronics Reliability,2015,55(12):2826-2832.
APA	Liao, Guanglan.,Chen, Pengfei*.,Du, Li.,Su, Lei.,Liu, Zhiping.,...&Shi, Tielin.(2015).Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration.Microelectronics Reliability,55(12),2826-2832.
MLA	Liao, Guanglan,et al."Using SOM neural network for X-ray inspection of missing-bump defects in three-dimensional integration".Microelectronics Reliability 55.12(2015):2826-2832.

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