QQ客服 官方微博 反馈留言

	An effective and efficient numerical method for thermal management in 3D stacked integrated circuits
	Xiao, Chengdi; He, Hu*; Li, Junhui*; Cao, Sen; Zhu, Wenhui
刊名	Applied Thermal Engineering
	2017
卷号	121期号:Volume 121页码:200-209
关键词	3D stacked ICs Through silicon vias Thermal management Numerical simulation
ISSN号	1359-4311
DOI	10.1016/j.applthermaleng.2017.04.080
URL标识	查看原文
WOS记录号	WOS:000406169600020;EI:20171703606651
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3340468
专题	中南大学
作者单位	1.[Xiao, Chengdi 2.Zhu, Wenhui 3.Cao, Sen 4.He, Hu 5.Li, Junhui] State Key Lab High Performance Complex Mfg, Changsha 410083, Hunan, Peoples R China.
推荐引用方式 GB/T 7714	Xiao, Chengdi,He, Hu*,Li, Junhui*,et al. An effective and efficient numerical method for thermal management in 3D stacked integrated circuits[J]. Applied Thermal Engineering,2017,121(Volume 121):200-209.
APA	Xiao, Chengdi,He, Hu*,Li, Junhui*,Cao, Sen,&Zhu, Wenhui.(2017).An effective and efficient numerical method for thermal management in 3D stacked integrated circuits.Applied Thermal Engineering,121(Volume 121),200-209.
MLA	Xiao, Chengdi,et al."An effective and efficient numerical method for thermal management in 3D stacked integrated circuits".Applied Thermal Engineering 121.Volume 121(2017):200-209.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。