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Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging
Chen, Yun*; Li, Han-Xiong; Shan, Xiuyang; Gao, Jian; Chen, Xin; Wang, Fuliang
刊名Ultrasonics Sonochemistry
2016
卷号28页码:15-20
关键词Lowering viscoelasticity Ultrasonic processing Epoxy Fluid dispensing
ISSN号1350-4177
DOI10.1016/j.ultsonch.2015.06.026
URL标识查看原文
WOS记录号WOS:000362919800003;EI:20152700999818
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/3338327
专题中南大学
作者单位1.[Chen, Xin
2.Chen, Yun
3.Gao, Jian] Guangdong Univ Technol, Key Lab Mech Equipment Mfg & Control Technol, Sch Electromech Engn, Guangzhou 510006, Guangdong, Peoples R China.
推荐引用方式
GB/T 7714
Chen, Yun*,Li, Han-Xiong,Shan, Xiuyang,et al. Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging[J]. Ultrasonics Sonochemistry,2016,28:15-20.
APA Chen, Yun*,Li, Han-Xiong,Shan, Xiuyang,Gao, Jian,Chen, Xin,&Wang, Fuliang.(2016).Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging.Ultrasonics Sonochemistry,28,15-20.
MLA Chen, Yun*,et al."Ultrasound aided smooth dispensing for high viscoelastic epoxy in microelectronic packaging".Ultrasonics Sonochemistry 28(2016):15-20.
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