QQ客服 官方微博 反馈留言

	Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives
	Wang, Yan; Zhu, Wenhui*; Li, Xiang; Wang, Fuliang*
刊名	Electrochimica Acta
	2016
卷号	221页码:70-79
关键词	Additives Filling Models Copper electrodeposition
ISSN号	0013-4686
DOI	10.1016/j.electacta.2016.09.144
URL标识	查看原文
WOS记录号	WOS:000390746600010;EI:20164502979909
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3333377
专题	中南大学
作者单位	1.[Zhu, Wenhui 2.Zhu, WH 3.Wang, FL 4.Wang, Fuliang 5.Wang, Yan] Cent S Univ, State Key Lab High Performance Complex Mfg, Changsha 410083, Hunan, Peoples R China.
推荐引用方式 GB/T 7714	Wang, Yan,Zhu, Wenhui*,Li, Xiang,et al. Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives[J]. Electrochimica Acta,2016,221:70-79.
APA	Wang, Yan,Zhu, Wenhui*,Li, Xiang,&Wang, Fuliang*.(2016).Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives.Electrochimica Acta,221,70-79.
MLA	Wang, Yan,et al."Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives".Electrochimica Acta 221(2016):70-79.

个性服务

查看访问统计

相关权益政策

暂无数据

收藏/分享

除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。