Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties | |
Tu, Xiaoxuan; Yi, Danqing; Wu, Jing; Wang, Bin* | |
刊名 | Journal of Alloys and Compounds
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2017 | |
卷号 | 698页码:317-328 |
关键词 | SAC305-xCe solder joints Thermal behavior Intermetallic compounds evolution Mechanical properties |
ISSN号 | 0925-8388 |
DOI | 10.1016/j.jallcom.2016.12.191 |
URL标识 | 查看原文 |
WOS记录号 | WOS:000393586300042;EI:20165203180227 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3331261 |
专题 | 中南大学 |
作者单位 | 1.[Tu, Xiaoxuan 2.Yi, Danqing 3.Wang, Bin] Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Hunan, Peoples R China. |
推荐引用方式 GB/T 7714 | Tu, Xiaoxuan,Yi, Danqing,Wu, Jing,et al. Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties[J]. Journal of Alloys and Compounds,2017,698:317-328. |
APA | Tu, Xiaoxuan,Yi, Danqing,Wu, Jing,&Wang, Bin*.(2017).Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties.Journal of Alloys and Compounds,698,317-328. |
MLA | Tu, Xiaoxuan,et al."Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties".Journal of Alloys and Compounds 698(2017):317-328. |
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