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	Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties
	Tu, Xiaoxuan; Yi, Danqing; Wu, Jing; Wang, Bin*
刊名	Journal of Alloys and Compounds
	2017
卷号	698页码:317-328
关键词	SAC305-xCe solder joints Thermal behavior Intermetallic compounds evolution Mechanical properties
ISSN号	0925-8388
DOI	10.1016/j.jallcom.2016.12.191
URL标识	查看原文
WOS记录号	WOS:000393586300042;EI:20165203180227
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3331261
专题	中南大学
作者单位	1.[Tu, Xiaoxuan 2.Yi, Danqing 3.Wang, Bin] Cent S Univ, Sch Mat Sci & Engn, Changsha 410083, Hunan, Peoples R China.
推荐引用方式 GB/T 7714	Tu, Xiaoxuan,Yi, Danqing,Wu, Jing,et al. Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties[J]. Journal of Alloys and Compounds,2017,698:317-328.
APA	Tu, Xiaoxuan,Yi, Danqing,Wu, Jing,&Wang, Bin*.(2017).Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties.Journal of Alloys and Compounds,698,317-328.
MLA	Tu, Xiaoxuan,et al."Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties".Journal of Alloys and Compounds 698(2017):317-328.

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