| Asymptotic solutions for buckling delamination induced crack propagation in the thin film- Compliant substrate system | |
| Lu, Tongqing; Wang, T. J. | |
| 2013 | |
| 关键词 | Asymptotic solutions Compliant substrates Delamination buckling Fabrication process Film-substrate systems Interface crack Post buckling deformation Postbuckling |
| 卷号 | 6 |
| 期号 | [db:dc_citation_issue] |
| DOI | [db:dc_identifier_doi] |
| 页码 | 4800-4805 |
| 会议录 | 13th International Conference on Fracture 2013, ICF 2013
 |
| URL标识 | 查看原文 |
| ISSN号 | 9781629933696 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3307160 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Lu, Tongqing,Wang, T. J.. Asymptotic solutions for buckling delamination induced crack propagation in the thin film- Compliant substrate system[C]. 见:. |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论