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	Decomposition Characteristics of SF6 under Partial Discharges with Point-to-plane Electrode Defect
	Ding Weidong; Zhou Wenwu; Ren Xiang; Li Guojun; Fan Chuan; Duan Wei; Song Gao
刊名	IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION
	2013
卷号	20期号:[db:dc_citation_issue]页码:1727-1736
关键词	point-to-plane electrode defect Decomposition compound analysis gas insulated switchgear SF6
ISSN号	1070-9878
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3307146
专题	西安交通大学
推荐引用方式 GB/T 7714	Ding Weidong,Zhou Wenwu,Ren Xiang,et al. Decomposition Characteristics of SF6 under Partial Discharges with Point-to-plane Electrode Defect[J]. IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION,2013,20([db:dc_citation_issue]):1727-1736.
APA	Ding Weidong.,Zhou Wenwu.,Ren Xiang.,Li Guojun.,Fan Chuan.,...&Song Gao.(2013).Decomposition Characteristics of SF6 under Partial Discharges with Point-to-plane Electrode Defect.IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION,20([db:dc_citation_issue]),1727-1736.
MLA	Ding Weidong,et al."Decomposition Characteristics of SF6 under Partial Discharges with Point-to-plane Electrode Defect".IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION 20.[db:dc_citation_issue](2013):1727-1736.

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