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	Three-dimensional metallic microcomponents achieved in fused silica by a femtosecond-laser-based microsolidifying process
	Liu, Keyin; Yang, Qing; Zhao, Yulong; Chen, Feng; Shan, Chao; He, Shengguan; Fan, Xiaole; Li, Lei; Meng, Xiangwei; Du, Guangqing
刊名	MICROELECTRONIC ENGINEERING
	2014
卷号	113期号:[db:dc_citation_issue]页码:93-97
关键词	3D metallic microstructures Femtosecond laser Liquid metal Microsolidifying
ISSN号	0167-9317
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3294662
专题	西安交通大学
推荐引用方式 GB/T 7714	Liu, Keyin,Yang, Qing,Zhao, Yulong,et al. Three-dimensional metallic microcomponents achieved in fused silica by a femtosecond-laser-based microsolidifying process[J]. MICROELECTRONIC ENGINEERING,2014,113([db:dc_citation_issue]):93-97.
APA	Liu, Keyin.,Yang, Qing.,Zhao, Yulong.,Chen, Feng.,Shan, Chao.,...&Bian, Hao.(2014).Three-dimensional metallic microcomponents achieved in fused silica by a femtosecond-laser-based microsolidifying process.MICROELECTRONIC ENGINEERING,113([db:dc_citation_issue]),93-97.
MLA	Liu, Keyin,et al."Three-dimensional metallic microcomponents achieved in fused silica by a femtosecond-laser-based microsolidifying process".MICROELECTRONIC ENGINEERING 113.[db:dc_citation_issue](2014):93-97.

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