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	In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluorescence XAFS
	Zhao, N.; Yao, M. J.; Ma, H. T.; Wong, C. P.
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2017
卷号	28页码:8824-8831
ISSN号	0957-4522
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3283908
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA.
推荐引用方式 GB/T 7714	Zhao, N.,Yao, M. J.,Ma, H. T.,et al. In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluorescence XAFS[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28:8824-8831.
APA	Zhao, N.,Yao, M. J.,Ma, H. T.,&Wong, C. P..(2017).In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluorescence XAFS.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,28,8824-8831.
MLA	Zhao, N.,et al."In situ study on liquid structure of Sn during Sn/Cu liquid-solid interfacial reaction by fluorescence XAFS".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 28(2017):8824-8831.

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