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	Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration
	Yao, Mingjun; Fan, Jun; Zhao, Ning; Xiao, Zhiyi; Yu, Daquan; Ma, Haitao
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2017
卷号	28页码:9091-9095
ISSN号	0957-4522
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3283902
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300, Peoples R China.
推荐引用方式 GB/T 7714	Yao, Mingjun,Fan, Jun,Zhao, Ning,et al. Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28:9091-9095.
APA	Yao, Mingjun,Fan, Jun,Zhao, Ning,Xiao, Zhiyi,Yu, Daquan,&Ma, Haitao.(2017).Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,28,9091-9095.
MLA	Yao, Mingjun,et al."Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 28(2017):9091-9095.

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