Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration | |
Yao, Mingjun; Fan, Jun; Zhao, Ning; Xiao, Zhiyi; Yu, Daquan; Ma, Haitao | |
刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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2017 | |
卷号 | 28页码:9091-9095 |
ISSN号 | 0957-4522 |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3283902 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Huatian Technol Kunshan Elect Co Ltd, Kunshan 215300, Peoples R China. |
推荐引用方式 GB/T 7714 | Yao, Mingjun,Fan, Jun,Zhao, Ning,et al. Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017,28:9091-9095. |
APA | Yao, Mingjun,Fan, Jun,Zhao, Ning,Xiao, Zhiyi,Yu, Daquan,&Ma, Haitao.(2017).Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,28,9091-9095. |
MLA | Yao, Mingjun,et al."Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 28(2017):9091-9095. |
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