Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect | |
Zhao, N.; Zhong, Y.; Dong, W.; Huang, M. L.; Ma, H. T.; Wong, C. P. | |
刊名 | APPLIED PHYSICS LETTERS
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2017 | |
卷号 | 110 |
ISSN号 | 0003-6951 |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3282209 |
专题 | 大连理工大学 |
作者单位 | 1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA. |
推荐引用方式 GB/T 7714 | Zhao, N.,Zhong, Y.,Dong, W.,et al. Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect[J]. APPLIED PHYSICS LETTERS,2017,110. |
APA | Zhao, N.,Zhong, Y.,Dong, W.,Huang, M. L.,Ma, H. T.,&Wong, C. P..(2017).Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect.APPLIED PHYSICS LETTERS,110. |
MLA | Zhao, N.,et al."Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect".APPLIED PHYSICS LETTERS 110(2017). |
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