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	Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect
	Zhao, N.; Zhong, Y.; Dong, W.; Huang, M. L.; Ma, H. T.; Wong, C. P.
刊名	APPLIED PHYSICS LETTERS
	2017
卷号	110
ISSN号	0003-6951
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3282209
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 2.Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA.
推荐引用方式 GB/T 7714	Zhao, N.,Zhong, Y.,Dong, W.,et al. Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect[J]. APPLIED PHYSICS LETTERS,2017,110.
APA	Zhao, N.,Zhong, Y.,Dong, W.,Huang, M. L.,Ma, H. T.,&Wong, C. P..(2017).Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect.APPLIED PHYSICS LETTERS,110.
MLA	Zhao, N.,et al."Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro interconnects under temperature gradient effect".APPLIED PHYSICS LETTERS 110(2017).

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