Micromachining of multi-thickness sensor-array structures with dual-stage etching technology

	Micromachining of multi-thickness sensor-array structures with dual-stage etching technology
	Li,XX ; Bao,MH
刊名	JOURNAL OF MICROMECHANICS AND MICROENGINEERING
	2001
卷号	11 期号:3 页码:239-244
关键词	SILICON
ISSN号	0960-1317
通讯作者	Li, XX, Chinese Acad Sci, Shanghai Inst Met, State Key Lab Transducer Technol, 865 Changning Rd, Shanghai 200050, Peoples R China
学科主题	Engineering ; Electrical & Electronic; Nanoscience & Nanotechnology; Instruments & Instrumentation; Materials Science ; Multidisciplinary; Mechanics
收录类别	SCI
公开日期	2011-12-17
内容类型	期刊论文
源URL	[http://ir.sim.ac.cn/handle/331004/38761]
专题	上海微系统与信息技术研究所_微系统技术_期刊论文
推荐引用方式 GB/T 7714	Li,XX,Bao,MH. Micromachining of multi-thickness sensor-array structures with dual-stage etching technology[J]. JOURNAL OF MICROMECHANICS AND MICROENGINEERING,2001,11(3):239-244.
APA	Li,XX,&Bao,MH.(2001).Micromachining of multi-thickness sensor-array structures with dual-stage etching technology.JOURNAL OF MICROMECHANICS AND MICROENGINEERING,11(3),239-244.
MLA	Li,XX,et al."Micromachining of multi-thickness sensor-array structures with dual-stage etching technology".JOURNAL OF MICROMECHANICS AND MICROENGINEERING 11.3(2001):239-244.