| Monitoring of pin connection loosening using eletromechanical impedance: Numerical simulation with experimental verification | |
| Fan, Shuli; Li, Weijie; Kong, Qingzhao; Feng, Qian; Song, Gangbing | |
| 刊名 | JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES
 |
| 2018 | |
| 卷号 | 29页码:1964-1973 |
| 关键词 | Structural health monitoring piezoelectric electromechanical impedance finite element method pin-connected structure |
| ISSN号 | 1045-389X |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3264013 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, State Key Lab Coastal & Offshore Engn, Dalian, Peoples R China. 2.Univ Houston, Dept Mech Engn, Smart Mat & Struct Lab, Houston, TX 77004 USA. 3.Univ Houston, Dept Mech Engn, Smart Mat & Struct Lab, Houston, TX 77004 USA. 4.China Earthquake Adm, Inst Seismol, Hubei Key Lab Earthquake Early Warning, Wuhan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Fan, Shuli,Li, Weijie,Kong, Qingzhao,et al. Monitoring of pin connection loosening using eletromechanical impedance: Numerical simulation with experimental verification[J]. JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES,2018,29:1964-1973. |
| APA | Fan, Shuli,Li, Weijie,Kong, Qingzhao,Feng, Qian,&Song, Gangbing.(2018).Monitoring of pin connection loosening using eletromechanical impedance: Numerical simulation with experimental verification.JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES,29,1964-1973. |
| MLA | Fan, Shuli,et al."Monitoring of pin connection loosening using eletromechanical impedance: Numerical simulation with experimental verification".JOURNAL OF INTELLIGENT MATERIAL SYSTEMS AND STRUCTURES 29(2018):1964-1973. |
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