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	Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chips
	Wang Hong; Yun Feng; Liu Shuo; Huang Ya-Ping; Wang Yue; Zhang Wei-Han; Wei Zheng-Hong; Ding Wen; Li Yu-Feng; Zhang Ye
刊名	ACTA PHYSICA SINICA
	2015
卷号	64期号:[db:dc_citation_issue]
关键词	residual stress laser lift-off vertical light emitting diodes wafer bonding
ISSN号	1000-3290
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3260556
专题	西安交通大学
推荐引用方式 GB/T 7714	Wang Hong,Yun Feng,Liu Shuo,et al. Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chips[J]. ACTA PHYSICA SINICA,2015,64([db:dc_citation_issue]).
APA	Wang Hong.,Yun Feng.,Liu Shuo.,Huang Ya-Ping.,Wang Yue.,...&Guo Mao-Feng.(2015).Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chips.ACTA PHYSICA SINICA,64([db:dc_citation_issue]).
MLA	Wang Hong,et al."Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chips".ACTA PHYSICA SINICA 64.[db:dc_citation_issue](2015).

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