| Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation | |
| Ren, Mingfa; Wang, Qi; Cong, Jie; Chang, Xin | |
| 刊名 | SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS
 |
| 2018 | |
| 卷号 | 25页码:1197-1204 |
| 关键词 | cure simulation degree of cure finite element analysis one- and three-dimensional analysis thermoset matrix laminates |
| ISSN号 | 0792-1233 |
| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3254132 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, State Key Lab Struct Anal Ind Equipment, Dept Engn Mech, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Dept Engn Mech, Dalian 116024, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Ren, Mingfa,Wang, Qi,Cong, Jie,et al. Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation[J]. SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS,2018,25:1197-1204. |
| APA | Ren, Mingfa,Wang, Qi,Cong, Jie,&Chang, Xin.(2018).Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation.SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS,25,1197-1204. |
| MLA | Ren, Mingfa,et al."Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation".SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS 25(2018):1197-1204. |
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