| A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes | |
| Kunwar, Anil; Shang, Shengyan; Raback, Peter; Song, Xueguan; Malla, Prafulla Bahadur; Wang, Yunpeng; Ma, Haitao | |
| 2018 | |
| 会议名称 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
| 会议日期 | 2018-01-01 |
| 关键词 | Miniaturization Pb-free solder FEM Current density Temperature |
| 页码 | 1329-1332 |
| 会议录 | 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3253355 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian Univ Technol, Sch Mech Engn, Dalian 116024, Peoples R China. 2.Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China. 3.CSC IT Ctr Sci, Keilaranta 14,POB 405, FIN-02101 Espoo, Finland. 4.Sichuan Univ, Coll Architecture & Environm, Chengdu 610065, Sichuan, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Kunwar, Anil,Shang, Shengyan,Raback, Peter,et al. A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes[C]. 见:2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT). 2018-01-01. |
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