Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging | |
Wu, Guanglei; Cheng, Yonghong; Wang, Kuikui; Wang, Yiqun; Feng, Ailing | |
刊名 | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
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2016 | |
卷号 | 27期号:[db:dc_citation_issue]页码:5592-5599 |
ISSN号 | 0957-4522 |
DOI | [db:dc_identifier_doi] |
URL标识 | 查看原文 |
WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3229312 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Wu, Guanglei,Cheng, Yonghong,Wang, Kuikui,et al. Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27([db:dc_citation_issue]):5592-5599. |
APA | Wu, Guanglei,Cheng, Yonghong,Wang, Kuikui,Wang, Yiqun,&Feng, Ailing.(2016).Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27([db:dc_citation_issue]),5592-5599. |
MLA | Wu, Guanglei,et al."Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.[db:dc_citation_issue](2016):5592-5599. |
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