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	Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging
	Wu, Guanglei; Cheng, Yonghong; Wang, Kuikui; Wang, Yiqun; Feng, Ailing
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2016
卷号	27期号:[db:dc_citation_issue]页码:5592-5599
ISSN号	0957-4522
DOI	[db:dc_identifier_doi]
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3229312
专题	西安交通大学
推荐引用方式 GB/T 7714	Wu, Guanglei,Cheng, Yonghong,Wang, Kuikui,et al. Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016,27([db:dc_citation_issue]):5592-5599.
APA	Wu, Guanglei,Cheng, Yonghong,Wang, Kuikui,Wang, Yiqun,&Feng, Ailing.(2016).Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,27([db:dc_citation_issue]),5592-5599.
MLA	Wu, Guanglei,et al."Fabrication and characterization of OMMt/BMI/CE composites with low dielectric properties and high thermal stability for electronic packaging".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 27.[db:dc_citation_issue](2016):5592-5599.

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