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	The roles of Hf element in optimizing strength, ductility and electrical conductivity of copper alloys
	Li, Rengeng; Zhang, Siruo; Zou, Cunlei; Kang, Huijun; Wang, Tongmin
刊名	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
	2019
卷号	758页码:130-138
关键词	Cu-Cr-Zr-Hf alloy Tensile strength Ductility Electrical conductivity
ISSN号	0921-5093
URL标识	查看原文
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3216117
专题	大连理工大学
作者单位	1.Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Solidificat Control & Digital Preparat Te, Dalian 116024, Peoples R China. 2.Dalian Jiaotong Univ, Sch Mat Sci & Engn, Dalian 116028, Peoples R China.
推荐引用方式 GB/T 7714	Li, Rengeng,Zhang, Siruo,Zou, Cunlei,et al. The roles of Hf element in optimizing strength, ductility and electrical conductivity of copper alloys[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2019,758:130-138.
APA	Li, Rengeng,Zhang, Siruo,Zou, Cunlei,Kang, Huijun,&Wang, Tongmin.(2019).The roles of Hf element in optimizing strength, ductility and electrical conductivity of copper alloys.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,758,130-138.
MLA	Li, Rengeng,et al."The roles of Hf element in optimizing strength, ductility and electrical conductivity of copper alloys".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 758(2019):130-138.

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