State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography | |
Li, Kongjing[1]; Tian, Gui Yun[1,2]; Cheng, Liang[1]; Yin, Aijun[1,3]; Cao, Wenping[1]; Crichton, Stuart[1] | |
2014 | |
卷号 | 29页码:5000-5009 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/3179821 |
专题 | 重庆大学 |
推荐引用方式 GB/T 7714 | Li, Kongjing[1],Tian, Gui Yun[1,2],Cheng, Liang[1],et al. State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography[J],2014,29:5000-5009. |
APA | Li, Kongjing[1],Tian, Gui Yun[1,2],Cheng, Liang[1],Yin, Aijun[1,3],Cao, Wenping[1],&Crichton, Stuart[1].(2014).State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography.,29,5000-5009. |
MLA | Li, Kongjing[1],et al."State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography".29(2014):5000-5009. |
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