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	Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method
	He, Huirong[1]; Chen, Jida[1]; Zhang, Shengtao[1]; Liao, Minhui[1]; Li, Lingxing[1]; He, Wei[2]; Chen, Yuanming[2]; Chen, Shijin[3]
	2017
卷号	43页码:131-138
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3052590
专题	重庆大学
推荐引用方式 GB/T 7714	He, Huirong[1],Chen, Jida[1],Zhang, Shengtao[1],et al. Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method[J],2017,43:131-138.
APA	He, Huirong[1].,Chen, Jida[1].,Zhang, Shengtao[1].,Liao, Minhui[1].,Li, Lingxing[1].,...&Chen, Shijin[3].(2017).Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method.,43,131-138.
MLA	He, Huirong[1],et al."Fabrication and surface treatment of fine copper lines for HDI printed circuit board with modified full-additive method".43(2017):131-138.

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