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	单纯形优化法研究改良型全加成PCB的铜电镀液配方 Study on copper electroplating bath composition by simplex optimization for PCB made by modified full additive process
	何慧蓉[1]; 陈际达[1]; 陈世金[2]; 何为[3]; 胡志强[3]; 郭茂桂[2]; 龚智伟[2]
	2016
卷号	35页码:677-680
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3034830
专题	重庆大学
推荐引用方式 GB/T 7714	何慧蓉[1],陈际达[1],陈世金[2],等. 单纯形优化法研究改良型全加成PCB的铜电镀液配方 Study on copper electroplating bath composition by simplex optimization for PCB made by modified full additive process[J],2016,35:677-680.
APA	何慧蓉[1].,陈际达[1].,陈世金[2].,何为[3].,胡志强[3].,...&龚智伟[2].(2016).单纯形优化法研究改良型全加成PCB的铜电镀液配方 Study on copper electroplating bath composition by simplex optimization for PCB made by modified full additive process.,35,677-680.
MLA	何慧蓉[1],et al."单纯形优化法研究改良型全加成PCB的铜电镀液配方 Study on copper electroplating bath composition by simplex optimization for PCB made by modified full additive process".35(2016):677-680.

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