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	Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints
	Zhao Guo-ji[1,2]; Wen Guang-hua[1]; Sheng Guang-min[1]; Jing Yan-xia[1]
	2016
卷号	23页码:1831-1838
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2979958
专题	重庆大学
推荐引用方式 GB/T 7714	Zhao Guo-ji[1,2],Wen Guang-hua[1],Sheng Guang-min[1],et al. Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints[J],2016,23:1831-1838.
APA	Zhao Guo-ji[1,2],Wen Guang-hua[1],Sheng Guang-min[1],&Jing Yan-xia[1].(2016).Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints.,23,1831-1838.
MLA	Zhao Guo-ji[1,2],et al."Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints".23(2016):1831-1838.

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