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	An analytical model of chip heat-carrying capacity for high-speed dry hobbing based on 3D chip geometry
	Yang, Xiao[1]; Cao, Hua-jun[1]; Chen, Yong-peng[2]; Zhu, Li-Bin[1]; Li, Ben-jie[1]
	2017
卷号	18页码:245-256
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2978376
专题	重庆大学
推荐引用方式 GB/T 7714	Yang, Xiao[1],Cao, Hua-jun[1],Chen, Yong-peng[2],et al. An analytical model of chip heat-carrying capacity for high-speed dry hobbing based on 3D chip geometry[J],2017,18:245-256.
APA	Yang, Xiao[1],Cao, Hua-jun[1],Chen, Yong-peng[2],Zhu, Li-Bin[1],&Li, Ben-jie[1].(2017).An analytical model of chip heat-carrying capacity for high-speed dry hobbing based on 3D chip geometry.,18,245-256.
MLA	Yang, Xiao[1],et al."An analytical model of chip heat-carrying capacity for high-speed dry hobbing based on 3D chip geometry".18(2017):245-256.

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