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	An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue
	Li, Hui[1]; Hu, Yaogang[1]; Liu, Shengquan[2]; Li, Yang[1]; Liao, Xinglin[1]; Liu, Zhixiang[3]
	2016
卷号	16页码:570-575
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2978280
专题	重庆大学
推荐引用方式 GB/T 7714	Li, Hui[1],Hu, Yaogang[1],Liu, Shengquan[2],et al. An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue[J],2016,16:570-575.
APA	Li, Hui[1],Hu, Yaogang[1],Liu, Shengquan[2],Li, Yang[1],Liao, Xinglin[1],&Liu, Zhixiang[3].(2016).An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue.,16,570-575.
MLA	Li, Hui[1],et al."An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue".16(2016):570-575.

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