An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue | |
Li, Hui[1]; Hu, Yaogang[1]; Liu, Shengquan[2]; Li, Yang[1]; Liao, Xinglin[1]; Liu, Zhixiang[3] | |
2016 | |
卷号 | 16页码:570-575 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2978280 |
专题 | 重庆大学 |
推荐引用方式 GB/T 7714 | Li, Hui[1],Hu, Yaogang[1],Liu, Shengquan[2],et al. An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue[J],2016,16:570-575. |
APA | Li, Hui[1],Hu, Yaogang[1],Liu, Shengquan[2],Li, Yang[1],Liao, Xinglin[1],&Liu, Zhixiang[3].(2016).An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue.,16,570-575. |
MLA | Li, Hui[1],et al."An Improved Thermal Network Model of the IGBT Module for Wind Power Converters Considering the Effects of Base-Plate Solder Fatigue".16(2016):570-575. |
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