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	Influence of POSS nano-particles on Sn-3.0Ag-0.5Cu-xPOSS/Cu composite solder joints during isothermal aging
	Shen, Jun[1]; Tang, Qin[1]; Pu, Yayun[1]; Zhai, Dajun[1]; Cao, Zhongming[1]; Chen, Jie[1]
	2013
卷号	24页码:4881-4887
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2970679
专题	重庆大学
推荐引用方式 GB/T 7714	Shen, Jun[1],Tang, Qin[1],Pu, Yayun[1],et al. Influence of POSS nano-particles on Sn-3.0Ag-0.5Cu-xPOSS/Cu composite solder joints during isothermal aging[J],2013,24:4881-4887.
APA	Shen, Jun[1],Tang, Qin[1],Pu, Yayun[1],Zhai, Dajun[1],Cao, Zhongming[1],&Chen, Jie[1].(2013).Influence of POSS nano-particles on Sn-3.0Ag-0.5Cu-xPOSS/Cu composite solder joints during isothermal aging.,24,4881-4887.
MLA	Shen, Jun[1],et al."Influence of POSS nano-particles on Sn-3.0Ag-0.5Cu-xPOSS/Cu composite solder joints during isothermal aging".24(2013):4881-4887.

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