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	Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology
	Zhao, Libo; Li, Jie; Li, Zhikang; Zhang, Jiawang; Zhao, Yihe; Wang, Jiuhong; Xia, Yong; Li, Ping; Zhao, Yulong; Jiang, Zhuangde
刊名	SENSORS AND ACTUATORS A-PHYSICAL
	2017
卷号	264页码:63-75
关键词	Thermal deflection Parasitic capacitance Low temperature direct wafer-bonding CMUTs Thermal stress
ISSN号	0924-4247
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2946898
专题	西安交通大学
推荐引用方式 GB/T 7714	Zhao, Libo,Li, Jie,Li, Zhikang,et al. Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology[J]. SENSORS AND ACTUATORS A-PHYSICAL,2017,264:63-75.
APA	Zhao, Libo.,Li, Jie.,Li, Zhikang.,Zhang, Jiawang.,Zhao, Yihe.,...&Jiang, Zhuangde.(2017).Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology.SENSORS AND ACTUATORS A-PHYSICAL,264,63-75.
MLA	Zhao, Libo,et al."Fabrication of capacitive micromachined ultrasonic transducers with low-temperature direct wafer-Bonding technology".SENSORS AND ACTUATORS A-PHYSICAL 264(2017):63-75.

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