Boundary conditions optimization of spindle thermal error analysis and thermal key points selection based on inverse heat conduction | |
Li, Yang; Zhao, Wanhua; Wu, Wenwu; Lu, Bingheng | |
刊名 | INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY |
2017 | |
卷号 | 90页码:2803-2812 |
关键词 | Mean impact value Coefficients of convection heat transfer Inverse heat transfer Thermal error Thermal key point |
ISSN号 | 0268-3768 |
URL标识 | 查看原文 |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2941491 |
专题 | 西安交通大学 |
推荐引用方式 GB/T 7714 | Li, Yang,Zhao, Wanhua,Wu, Wenwu,et al. Boundary conditions optimization of spindle thermal error analysis and thermal key points selection based on inverse heat conduction[J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2017,90:2803-2812. |
APA | Li, Yang,Zhao, Wanhua,Wu, Wenwu,&Lu, Bingheng.(2017).Boundary conditions optimization of spindle thermal error analysis and thermal key points selection based on inverse heat conduction.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,90,2803-2812. |
MLA | Li, Yang,et al."Boundary conditions optimization of spindle thermal error analysis and thermal key points selection based on inverse heat conduction".INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY 90(2017):2803-2812. |
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