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	Novel Method of Aluminum to Copper Bonding by Cold Spray
	Fu, Si-Lin; Li, Cheng-Xin; Wei, Ying-Kang; Luo, Xiao-Tao; Yang, Guan-Jun; Li, Chang-Jiu; Li, Jing-Long
刊名	JOURNAL OF THERMAL SPRAY TECHNOLOGY
	2018
卷号	27页码:624-640
关键词	dissimilar metal joint mechanical property in situ shot peening cold spraying microstructure
ISSN号	1059-9630
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2922945
专题	西安交通大学
推荐引用方式 GB/T 7714	Fu, Si-Lin,Li, Cheng-Xin,Wei, Ying-Kang,et al. Novel Method of Aluminum to Copper Bonding by Cold Spray[J]. JOURNAL OF THERMAL SPRAY TECHNOLOGY,2018,27:624-640.
APA	Fu, Si-Lin.,Li, Cheng-Xin.,Wei, Ying-Kang.,Luo, Xiao-Tao.,Yang, Guan-Jun.,...&Li, Jing-Long.(2018).Novel Method of Aluminum to Copper Bonding by Cold Spray.JOURNAL OF THERMAL SPRAY TECHNOLOGY,27,624-640.
MLA	Fu, Si-Lin,et al."Novel Method of Aluminum to Copper Bonding by Cold Spray".JOURNAL OF THERMAL SPRAY TECHNOLOGY 27(2018):624-640.

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