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	Investigation of material flow behaviour and chip formation mechanism during grinding of glass-ceramics by nanoscratch.
	Yang, Xue; Qiu, Zhongjun; Wang, Yuge
刊名	Ceramics International
	2019
卷号	Vol.45 No.13页码:15954-15963
关键词	Chip formation Glass-ceramics Material flow Material removal mechanism Stress distribution
ISSN号	0272-8842
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2903689
专题	天津大学
作者单位	1.1 State Key Laboratory of Precision Measuring Technology & 2.Instruments, Tianjin University, Tianjin, 300072, China
推荐引用方式 GB/T 7714	Yang, Xue,Qiu, Zhongjun,Wang, Yuge. Investigation of material flow behaviour and chip formation mechanism during grinding of glass-ceramics by nanoscratch.[J]. Ceramics International,2019,Vol.45 No.13:15954-15963.
APA	Yang, Xue,Qiu, Zhongjun,&Wang, Yuge.(2019).Investigation of material flow behaviour and chip formation mechanism during grinding of glass-ceramics by nanoscratch..Ceramics International,Vol.45 No.13,15954-15963.
MLA	Yang, Xue,et al."Investigation of material flow behaviour and chip formation mechanism during grinding of glass-ceramics by nanoscratch.".Ceramics International Vol.45 No.13(2019):15954-15963.

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