Silicon Photonics Technology on 200-mm CMOS Platform for High Integration Applications

	Silicon Photonics Technology on 200-mm CMOS Platform for High Integration Applications
	Li ZH(李志华); Li B(李彬); Tang B(唐波); Zhang P(张鹏); Liu DQ(刘道群); Liu RN(刘若男); Zhou ZY(周章渝); Yu JZ(余金中)
刊名	Proceedings of SPIE
	2018-11-08
文献子类	期刊论文
内容类型	期刊论文
源URL	[http://159.226.55.107/handle/172511/19079]
专题	微电子研究所_集成电路先导工艺研发中心
推荐引用方式 GB/T 7714	Li ZH,Li B,Tang B,et al. Silicon Photonics Technology on 200-mm CMOS Platform for High Integration Applications[J]. Proceedings of SPIE,2018.
APA	李志华.,李彬.,唐波.,张鹏.,刘道群.,...&余金中.(2018).Silicon Photonics Technology on 200-mm CMOS Platform for High Integration Applications.Proceedings of SPIE.
MLA	李志华,et al."Silicon Photonics Technology on 200-mm CMOS Platform for High Integration Applications".Proceedings of SPIE (2018).