A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer

	A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer
	Chen DP(陈大鹏); Wang YH(王英辉); Wang SK(王盛凯); Xu Y(徐杨)
刊名	JAPANESE JOURNAL OF APPLIED PHYSICS
	2017-11-24
文献子类	期刊论文
内容类型	期刊论文
源URL	[http://159.226.55.106/handle/172511/18087]
专题	微电子研究所_集成电路先导工艺研发中心
作者单位	中国科学院微电子研究所
推荐引用方式 GB/T 7714	Chen DP,Wang YH,Wang SK,et al. A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer[J]. JAPANESE JOURNAL OF APPLIED PHYSICS,2017.
APA	Chen DP,Wang YH,Wang SK,&Xu Y.(2017).A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer.JAPANESE JOURNAL OF APPLIED PHYSICS.
MLA	Chen DP,et al."A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer".JAPANESE JOURNAL OF APPLIED PHYSICS (2017).