A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer | |
Chen DP(陈大鹏)![]() ![]() ![]() | |
刊名 | JAPANESE JOURNAL OF APPLIED PHYSICS
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2017-11-24 | |
文献子类 | 期刊论文 |
内容类型 | 期刊论文 |
源URL | [http://159.226.55.106/handle/172511/18087] ![]() |
专题 | 微电子研究所_集成电路先导工艺研发中心 |
作者单位 | 中国科学院微电子研究所 |
推荐引用方式 GB/T 7714 | Chen DP,Wang YH,Wang SK,et al. A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer[J]. JAPANESE JOURNAL OF APPLIED PHYSICS,2017. |
APA | Chen DP,Wang YH,Wang SK,&Xu Y.(2017).A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer.JAPANESE JOURNAL OF APPLIED PHYSICS. |
MLA | Chen DP,et al."A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer".JAPANESE JOURNAL OF APPLIED PHYSICS (2017). |
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