半导体器件制造方法
钟汇才; 梁擎擎; 赵超
2016-08-23
著作权人中国科学院微电子研究所
专利号US9425288
国家美国
文献子类发明专利
英文摘要

A method of manufacturing a FinFET semiconductor device is provided, wherein the semiconductor fins are formed in a parallel arrangement which intersects the gates arranged in parallel. The polycrystalline silicon layer is deposited and then converted into a single crystal silicon layer such that the single crystal silicon layer and the semiconductor fins are integrated in essence, i.e., the source/drain region in the semiconductor fins is raised and the top area of the semiconductor fins is extended. Subsequently, the single crystal silicon layer above the top of the semiconductor fins is converted into a metal silicide so as to form a source/drain region contact. The source/drain region contact in the present invention has a larger area than that in a conventional FinFET, which decreases the contact resistance and facilitates the formation of a self-aligned metal plug in the follow-up process.

公开日期2014-01-09
申请日期2012-07-18
语种中文
内容类型专利
源URL[http://159.226.55.106/handle/172511/16629]  
专题微电子研究所_集成电路先导工艺研发中心
作者单位中国科学院微电子研究所
推荐引用方式
GB/T 7714
钟汇才,梁擎擎,赵超. 半导体器件制造方法. US9425288. 2016-08-23.
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