| Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps | |
| Cao LQ(曹立强); Dai FW(戴风伟) | |
| 刊名 | Journal of Materials SCIence: Materials in Electronics
 |
| 2017-11-07 | |
| 文献子类 | 期刊论文 |
| 内容类型 | 期刊论文 |
| 源URL | [http://159.226.55.106/handle/172511/17979]  |
| 专题 | 微电子研究所_系统封装与集成研发中心 |
| 推荐引用方式 GB/T 7714 | Cao LQ,Dai FW. Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps[J]. Journal of Materials SCIence: Materials in Electronics,2017. |
| APA | 曹立强,&戴风伟.(2017).Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps.Journal of Materials SCIence: Materials in Electronics. |
| MLA | 曹立强,et al."Investigation of intermetallic compound and voids growth in fine-pitch Sn–3.5Ag/Ni/Cu microbumps".Journal of Materials SCIence: Materials in Electronics (2017). |
| 个性服务 |
| 查看访问统计 |
| 相关权益政策 |
| 暂无数据 |
| 收藏/分享 |
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。
修改评论